Polishing Equipment
- Wafer edge brush polishing equipment This is equipment for polishing oxides, compounds, and crystal wafers using brushes.
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- Since wafers and spacers are alternately layered on the jig, many wafers can be polished at once.
- Two brushes on the left and right side for outer circumference polishing, reducing polishing time.
- Ideal for edge polishing after beveling and LAP processes.
- Applicable as beveling process after slice.
- 10 different grinding conditions can be registered.
- Easy operation using touch panel.
- Glass disk substrate inner diameter edge brush polishing equipment This is equipment for polishing the inner diameter edge of glass magnetic disks.
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- Since the polishing section has two axes and each axis can be operated separately, space-saving and efficient work is possible.
- The brush is received at the top and bottom for a stable finish.
- Easy operation using touch panel
Feel free to inquire about brush-related questions regarding polishing at any time.